Photosensitive polysilazane composition, method of forming pattern therefrom, and method of burning coating film thereof
US6902875B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2001 |
| Grant date | Jun 7, 2005 |
| Priority date | — |
| Expiry date | Jul 24, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/127
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A finely patterned silica type ceramic film suitable as an inter-layer dielectric is formed in a short time by applying, onto a substrate, a positive working radiation sensitive polysilazane composition comprising a modified poly(sil sesquiazane) having a number average molecular weight of 100 to 100,000 and containing a basic constituent unit represented by the general formula: —[SiR6(NR7)1.5]— and other constituent units represented by the general formula: —[SiR62NR7]— and/or —[SiR63(NR7)0.5]— (R6 and R7 independently represent a hydrogen atom, a C1-3 alkyl group or a substituted or unsubstituted phenyl group) in a ratio of 0.1 to 100 mol-% to said basic constituent unit, a photo acid generator and preferably a water-soluble compound as a shape stabilizer, then patternwise exposing the resultant coating film, subjecting the exposed part of the coating film to moistening treatment, developing it with an aqueous alkali solution, wholly exposing the coating film to light and moistening treatment again, followed by burning treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.