Method of polishing a semiconductor device
US6903021B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 2004 |
| Grant date | Jun 7, 2005 |
| Priority date | — |
| Expiry date | May 19, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31591
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides a method of polishing a semiconductor device comprising, polishing the semiconductor device with a polishing pad, the polishing pad comprising, a polymeric matrix and a dissolvable substance. The dissolvable substance is located at a work surface of the polishing pad and in a subsurface proximate the work surface. The method further comprises dissolving the dissolvable substance at the work surface while polishing the semiconductor device and wearing away the polishing pad while polishing the semiconductor device such that the subsurface becomes a new work surface that polishes the semiconductor device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.