Arrangements to provide mechanical stiffening elements to a thin-core or coreless substrate
US6903278B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 29, 2001 |
| Grant date | Jun 7, 2005 |
| Priority date | — |
| Expiry date | Mar 5, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In substrate packaging and mounting, such as for a flip chip mounted on a thin-core or coreless substrate, a high degree of rigidness and support is imparted to the substrate, to overcome bending/flexing/distortion during mounting/packaging of the chip and to prevent possible chip damage, by a stiffener. Such a stiffener may be of one or multiple pieces in any suitable shape/form to allow its non-interfering positioning on the substrate, and made by any suitable process of any suitable material, including conductive material and material capable of withstanding the temperatures of chip mounting/bonding operations. Such a stiffener prevents bending/flexing/distortion of thin-core and coreless substrate arrangements during mounting/interconnection processes to achieve thinner and more light-weight electronics specifically afforded by thin-core/coreless substrate arrangements while lowering manufacturing time/costs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.