Substrate method and apparatus
US6903431B2 · kind B2 · utility
2Cited by
2References
21Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 28, 2003 |
| Grant date | Jun 7, 2005 |
| Priority date | — |
| Expiry date | May 28, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention relates to an apparatus and methods for reducing the impedance mismatch problem encountered by differential signaling in conductive core substrates, while maintaining adherence to the common mode noise assumption. Specifically, the conductive paths that traverse through the conductive core are separated by a nonconductive material which minimize impedance and interruption of the signal coupling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.