Optical package substrate, optical device, optical module, and method for molding optical package substrate
US6904190B2 · kind B2 · utility
10Cited by
12References
48Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2002 |
| Grant date | Jun 7, 2005 |
| Priority date | — |
| Expiry date | Dec 29, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4246
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Micro-discharge machining is employed to obtain a die, and an optical package substrate is produced by press formation using such a die. An optical fiber, an optical waveguide, a lens, an isolator, an optical filter and a light receiving/emitting element are mounted by passive alignment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.