Polishing pad for planarization
US6905402B2 · kind B2 · utility
14Cited by
7References
69Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2003 |
| Grant date | Jun 14, 2005 |
| Priority date | — |
| Expiry date | Sep 22, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/22
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention relates to a polishing pad. In particular, the polishing pad of the present invention comprises a sublayer, a middle layer, and a top layer which can function as a polishing layer. The polishing pad of the present invention is useful for polishing articles and particularly useful for chemical mechanical polishing or planarization of a microelectronic device, such as a semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.