Method of depositing a layer
US6905962B2 · kind B2 · utility
0Cited by
17References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 4, 2003 |
| Grant date | Jun 14, 2005 |
| Priority date | — |
| Expiry date | Sep 4, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/079
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
This invention relates to a method of depositing a layer on an exposed surface of an insulating layer of material. The method includes treating the exposed surface with hydrogen or a gaseous source of hydrogen in the presence of a plasma, prior to or during deposition of a metallic layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.