Poly(arylene ether) adhesive compositions
US6906120B1 · kind B1 · utility
9Cited by
24References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2000 |
| Grant date | Jun 14, 2005 |
| Priority date | — |
| Expiry date | Jan 10, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31794
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An adhesive for thermoplastic film is formed from a composition comprising a blend of a poly(arylene ether), a thermosetting resin, a toughening agent, an optional plasticizer, and a cure agent. The adhesive finds particular utility in circuit board applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.