Apparatus for thermal management of multiple core microprocessors
US6908227B2 · kind B2 · utility
95Cited by
48References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2002 |
| Grant date | Jun 21, 2005 |
| Priority date | — |
| Expiry date | Aug 23, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An apparatus for managing the temperature of an integrated circuit having a multiple core microprocessor is described. Specifically, thermal sensors are placed at potential hot spots throughout each microprocessor core. A thermal management unit monitors the thermal sensors. If a thermal sensor identifies a hot spot, the thermal management unit adjusts the operating frequency and voltage of that microprocessor core accordingly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.