Positive photosensitive resin composition, process for its preparation, and semiconductor devices
US6908717B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 9, 2001 |
| Grant date | Jun 21, 2005 |
| Priority date | — |
| Expiry date | Oct 9, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0226
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention provides a positve photosensitive resin composition of high sensitivity which can form a pattern of high resolution and high residual film ration and which can give a cured film superior in mechanical properties, adhesivity and water absorptivity. That is, the present invention lies in a positive photosensitve resin compostion comprising 100 parts by weight of an alkali-soluble resin, 1 to 100 parts by weight of a photosensitve diazoquinone compound (B) and a filler (C), characterized in that content F of the filler (C) represented by the following formula is 2 to 70% by weight.F=filler(C)/[alkali-soluble resing+filler (C)]
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.