Leads of a no-lead type package of a semiconductor device
US6909166B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2002 |
| Grant date | Jun 21, 2005 |
| Priority date | — |
| Expiry date | Mar 4, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to leads of a No-Lead type package which includes a chip having an active surface and a rear surface opposite the active surface. The active surface has a plurality of connection points with a plurality of leads arranged around the perimeter of the chip and a first and a second surface orthogonal to said first surface. A plurality of connection wires connect electrically the bonding pads of the chip to the first surface of the leads respectively. The package also includes a welding compound suitable for encapsulating the chip, the first surface of the leads and the bonding pads. The leads possess at least one hole in the second surface of the leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.