TAB type semiconductor device
US6909184B2 · kind B2 · utility
7Cited by
13References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 22, 2002 |
| Grant date | Jun 21, 2005 |
| Priority date | — |
| Expiry date | Oct 22, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/111
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
There is disclosed a TAB style BGA type semiconductor device. This semiconductor device comprises a semiconductor chip on which an integrated circuit is formed, and a polyimide tape which has a conductive pattern and which is allowed to adhere to the semiconductor chip. The conductive pattern includes a bonding portion connected to the pad of the semiconductor chip, a pad portion connected to the outside electrode, and an electrically floating island-like portion in addition to a wiring portion for connecting the bonding portion and the pad portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.