System for testing multiple groups of IC-chips which concurrently sends time-shifted test signals to the groups
US6909299B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2003 |
| Grant date | Jun 21, 2005 |
| Priority date | — |
| Expiry date | Nov 10, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2893
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electromechanical system for testing IC-chips includes a total of N chip holding subassemblies; a moving mechanism for automatically moving the i-th chip holding subassembly from a load position in the system to the test position in the systems, and visa-versa, where i ranges from 1 to N and changes with time in a sequence; and a signal generator which sends test signals to the IC-chips at the test position. Between the moving of the i-th chip holding subassembly and the next subassembly in the sequence, test signals are sent to the IC-chips on all N of the chip holding subassemblies such that the signals are shifted in time from one subassembly to another. Also, while the i-th chip holding subassembly is being moved, the time shifted test signals continue to be sent to the IC-chips on the remaining N−1 chip holding subassemblies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.