Small-scale optoelectronic package
US6910812B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2002 |
| Grant date | Jun 28, 2005 |
| Priority date | — |
| Expiry date | Oct 18, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An integrated circuit/optoelectronic packaging system (100) which comprises OE and IC components packaged to provide electrical input/output, thermal management, an optical window, and precise passive or mechanical alignment to external optical receivers or transmitters. A transparent insulating substrate having electrical circuitry in a thin silicon layer formed on its top side is positioned between the optical fiber and the optoelectronic device such that an optical path is described between the optoelectronic device and the optical fiber core through the transparent insulating substrate. The optoelectronic devices are mounted on the transparent insulating substrate in a precise positional relationship to guide holes in the substrate. The optical fibers are fixed in an optical fiber connector and are held in a precise positional relationship to guide holes in the connector. Alignment is accomplished with complementary guide pins that pass through guide holes in the fiber optic connector and in the transparent substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.