Contact for use in an integrated circuit and a method of manufacture therefor
US6910907B2 · kind B2 · utility
103Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2003 |
| Grant date | Jun 28, 2005 |
| Priority date | — |
| Expiry date | Nov 18, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76877
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a contact for use in an integrated circuit, a method of manufacture therefor, and an integrated circuit including the aforementioned contact. The contact, in accordance with the principles of the present invention, may include a via located in a substrate, and a contact plug located in the via, wherein the contact plug has a first portion having a notch removed therefrom and a second portion filling the notch.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.