Abrasive pad and process for the wet-chemical grinding of a substrate surface
US6911059B2 · kind B2 · utility
1Cited by
1References
11Claims
0Family size
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Key dates
| Filing date | Nov 26, 2003 |
| Grant date | Jun 28, 2005 |
| Priority date | — |
| Expiry date | Dec 20, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/34
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An abrasive pad is suitable for the wet-chemical grinding of a substrate surface. The novel abrasive pad has a polymer matrix with a defined water-solubility. The water-solubility is realized by the level of nonpolar and polar repeat units in the polymers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.