ALD apparatus and method
US6911092B2 · kind B2 · utility
534Cited by
36References
47Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 17, 2003 |
| Grant date | Jun 28, 2005 |
| Priority date | — |
| Expiry date | Aug 1, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/0396
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus and method for atomic layer deposition with improved efficiency of both chemical dose and purge is presented. The apparatus includes an integrated equipment and procedure for chamber maintenance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.