Patent · US Expired

Method to detect surface metal contamination

US6911347B2 · kind B2 · utility

10Cited by
2References
16Claims
0Family size

Assignee

Inventor

Key dates

Filing dateOct 5, 2001
Grant dateJun 28, 2005
Priority date
Expiry dateOct 5, 2021

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01N21/9501
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A method for detecting surface or near surface metal contamination in a semiconductor or silicon structure is described in which the structure or a part thereof is exposed to an excitation beam of predetermined wavelength and collecting luminescence from the structure in as the form of PL map having a substantially uniform PL intensity level provided by the semiconductor; and inspecting the map for one or more regions of enhanced PL intensity identifying characteristic surface or near surface metal contamination. In particular, the method is applied as an in-process quality control or as a quality control of processed structures such as interconnects.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.