Device and method for determining the lateral undercut of a structured surface layer

US6911348B1 · kind B1 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Volker Becker · Marxzell, DE
• Franz Laermer · Stuttgart, DE
• Andrea Schilp · Schwäbisch Gmünd, DE

Key dates

• Filing date: Mar 13, 2000
• Grant date: Jun 28, 2005
• Expiry date: Mar 13, 2020

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L22/12
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A device and a method for determining the extent of an at least locally lateral undercut of a structured surface layer on a sacrificial layer. The structured surface layer for this purpose locally has at least one passive electronic component, using which a physical measured quantity can be determined, which is proportional to the extent of the lateral undercut. The method for generating this device proposes, initially on the structured surface layer in a first etching method, to provide the surface layer at least locally with a structuring having trenches and, in a second etching method, proceeding from the trenches, to undertake at least locally a lateral undercut of the structured surface layer. In this context, in the first etching method on the surface layer, locally at least one passive electronic component is additionally delineated out, which in response to a subsequent undercutting of the surface layer is also undercut. The physical measured quantity is determined without contact, preferably by sending an electromagnetic emission into the passive component.