Semiconductor device adhesive sheet with conductor bodies buried therein
US6911720B2 · kind B2 · utility
5Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2002 |
| Grant date | Jun 28, 2005 |
| Priority date | — |
| Expiry date | Mar 28, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1062
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device, which is obtained by sticking an adhesive sheet 1 comprising a base material 2, an adhesive agent layer 3 formed on the base material 2 and conductor bodies 4 buried in the adhesive agent layer 3 to a semiconductor wafer, and removing the base material from the adhesive agent layer of the adhesive sheet 1. The adhesive agent layer 3 and a substrate are then aligned and the semiconductor wafer and the substrates are adhered via the adhesive agent layer 3 to thereby avoid defects caused by fluidity of an under filling material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.