Robot arm edge gripping device for handling substrates
US6913302B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2002 |
| Grant date | Jul 5, 2005 |
| Priority date | — |
| Expiry date | Apr 11, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S294/907
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An edge gripping device grips and ungrips a substrate, such as a semiconductor wafer. A blade extends in a distal direction from a base of the device. At least one distal contact member is provided at the tip of the blade. Two proximal lever arms are pivotally coupled for synchronized, oppositely directed rotation to the base. Each lever arm has at least one proximal contact member at an outer end. A biasing member is coupled to the two proximal lever arms and to an actuator to effect pivoting movement of the lever arms. The pivoting motion moves the ends of the arms generally radially toward and away from the center of the substrate to be gripped or ungripped, thereby minimizing sliding of the substrate. The biasing member is biased to retain the lever arms in a closed position in the event of a power failure. Ramps are provided next to each contact member. The contact members and ramps are profiled to minimize the zone of the substrate edge that is contacted. The lever arms are pivotally mounted with flexural pivot members having no sliding motion, to minimize particle generation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.