Alignment structure and method for mating a wafer delivery device to a wafer treatment tool
US6914251B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2003 |
| Grant date | Jul 5, 2005 |
| Priority date | — |
| Expiry date | Jun 24, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus and method for placement of workpieces such as silicon wafers in relation to an integrated circuit fabrication tool. A robotic arm mounted in relation to the tool moves workpieces in and out of the tool. A spacer has an exposed spacer surface facing away from the tool. The relative position of this exposed spacer surface is adjustable with respect to the tool. A movable cassette support supports one or more workpieces and is placed in abutting relationship with the spacer surface. It is onto this cassette support surface that a conveyor system such as an overhead transport delivers cassettes containing workpieces such as wafers for subsequent treatment by the tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.