Device for applying solder globules
US6915940B2 · kind B2 · utility
3Cited by
10References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2002 |
| Grant date | Jul 12, 2005 |
| Priority date | — |
| Expiry date | May 18, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3478
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for applying solder balls to a substrate and for remelting the solder balls on soldering points of the substrate has a capillary for supplying a solder ball to the soldering points and for placing the solder ball at the free end of the capillary opposite the soldering point, a means for supplying heat to the solder ball to remelt it, and a pressing apparatus for holding down the substrate to prevent the substrate from being resilient when placing and remelting the solder ball.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.