Chemical mechanical polishing apparatus having a stepped retaining ring and method for use thereof
US6916226B2 · kind B2 · utility
9Cited by
7References
39Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2002 |
| Grant date | Jul 12, 2005 |
| Priority date | — |
| Expiry date | Feb 14, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chemical mechanical processing apparatus includes a polishing pad capable of polishing a substrate; a stepped retaining having an inner side, a bottom side, and an open region, the open region extending radially outward from the inner side and upward from the bottom side, the open region providing space for pad rebound, the open region further having a plurality of tips to hold a substrate in position during rotation of the substrate against the polishing pad, the stepped retaining ring capable of rotating the substrate against the polishing pad; and a dispenser capable of dispensing a slurry onto the pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.