Gerard Moloney
14Patents
9h-index
15Co-inventors
61Inventor score
Filing activity: Apr 19, 1999 → Jun 13, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6506105B1 | System and method for pneumatic diaphragm CMP head having separate retaining ring and multi-region wafer pressure control | Performing Operations; Transporting | 61 | Expired |
| US6558232B1 | System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control | Performing Operations; Transporting | 51 | Expired |
| US6623343B2 | System and method for CMP head having multi-pressure annular zone subcarrier material removal control | Performing Operations; Transporting | 28 | Expired |
| US6309290A | Chemical mechanical polishing head having floating wafer retaining ring and wafer carrier with multi-zone polishing pressure control | Performing Operations; Transporting | 25 | Expired |
| US6893327B2 | Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface | Performing Operations; Transporting | 19 | Expired |
| US6887132B2 | Slurry distributor for chemical mechanical polishing apparatus and method of using the same | Performing Operations; Transporting | 17 | Expired |
| US6527625B1 | Chemical mechanical polishing apparatus and method having a soft backed polishing head | Performing Operations; Transporting | 10 | Expired |
| US7326103B2 | Vertically adjustable chemical mechanical polishing head and method for use thereof | Performing Operations; Transporting | 10 | Expired |
| US6916226B2 | Chemical mechanical polishing apparatus having a stepped retaining ring and method for use thereof | Performing Operations; Transporting | 9 | Expired |
| US7004822B2 | Chemical mechanical polishing and pad dressing method | Performing Operations; Transporting | 7 | Expired |
| US7125326B2 | Apparatus and method for removing a CMP polishing pad from a platen | Performing Operations; Transporting | 6 | Expired |
| US7118456B2 | Polishing head, retaining ring for use therewith and method fo polishing a substrate | Performing Operations; Transporting | 6 | Expired |
| US6966822B2 | System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control | Performing Operations; Transporting | 6 | Expired |
| US6641461B2 | Chemical mechanical polishing apparatus having edge, center and annular zone control of material removal | Performing Operations; Transporting | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.