Conductive adhesive, apparatus for mounting electronic component, and method for mounting the same
US6916433B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2001 |
| Grant date | Jul 12, 2005 |
| Priority date | — |
| Expiry date | May 24, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2982
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A conductive adhesive comprises main components of a conductive filler and a binder resin, and a content of the conductive filler is in a range from 20 wt % to 70 wt %. It is preferable that at least a part of the conductive filler has protrusions. A dendrite metal filler is especially preferred. When this adhesive is compressed, the resin component is squeezed out, while the conductive filler component remains inside. As a result, the concentration of the conductive filler component is raised inside, and this is useful in connecting the electrodes by scratching the surfaces of the electrodes. No solder is required in forming a conductive adhesive 3 on a substrate electrode 2 of a circuit substrate 1 and also for packaging an electronic element 4. Provided also are a package of an electronic element using the conductive adhesive with improved initial and long-term reliability, and a method of packaging the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.