Method and apparatus for decapping integrated circuit packages
US6917011B2 · kind B2 · utility
5Cited by
6References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2002 |
| Grant date | Jul 12, 2005 |
| Priority date | — |
| Expiry date | Mar 17, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention relates to a method and apparatus for decapping integrated circuit packages. The invention involves irradiating an IC package with laser radiation, typically in the UV-IR spectra and of short pulse duration. The irradiation results in ablation of the molding compound. The invention also provides real-time monitoring and process control of the decapping process and fluid-flow removal of ablation debris. Using the invention, decapping can be performed without causing damage to the internal IC structure. Furthermore, decapping in a liquid can prevent oxidization of the molding compound by ambient air.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.