Die carrier with fluid chamber

US6917099B2 · kind B2 · utility

Assignee

• HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. · US

Inventors

• Ronald A. Hellekson · Corvallis, US
• Chien-Hua Chen · Corvallis, US
• William Boucher · Corvallis, US
• Joshua W. Smith · Corvallis, US
• David Craig · Albany, US
• Gary J. Watts · Corvallis, US

Key dates

• Filing date: Aug 27, 2003
• Grant date: Jul 12, 2005
• Expiry date: Sep 17, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A die carrier has a body with a primary surface adapted for attachment to a substrate die. The body at least partially defines a fluid chamber. A fill port and an evacuate port are each fluidically connected to the fluid chamber.