Thin film forming apparatus and thin film forming method
US6918421B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2002 |
| Grant date | Jul 19, 2005 |
| Priority date | — |
| Expiry date | Feb 5, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/19
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
With a thin film bearing surface of a substrate directed toward an insulation film which is formed on a surface of a quartz plate, the substrate and the quartz plate are moved closer to each other and the insulation film is tightly adhered to the thin film bearing surface (adhering process). The quartz plate alone is then selectively peeled off, thereby completing transfer of the insulation film onto the substrate (peeling process). In this manner, the insulation film is disposed on the thin film bearing surface of the substrate, and a transportation mechanism then houses the substrate in a substrate cassette. Meanwhile, after the quartz plate is transported by the transportation mechanism to a cleaning unit and cleaned by the cleaning unit (cleaning process), the quartz plate is returned to a plate-like member cassette and waits in this cassette until reused next time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.