Method of stabilizing material layer
US6919102B2 · kind B2 · utility
1Cited by
6References
9Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 20, 2003 |
| Grant date | Jul 19, 2005 |
| Priority date | — |
| Expiry date | Jul 8, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/54
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of stabilizing the properties of a material layer is disclosed. A plurality of wafers are stored in a FOUP and in sequence the wafers are transferred to a chamber to proceed with deposition of a material layer and to the FOUP filled with a specific gas after deposition until all the wafers in the FOUP are treated. In the process of deposition, the wafers deposited with material layers on their surfaces are stored in the FOUP filled with specific gas. Therefore, the surface properties of all the wafers in the FOUP are stablilized and contamination due to outgassing is prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.