High resolution overlay alignment systems for imprint lithography
US6919152B2 · kind B2 · utility
29Cited by
75References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 2003 |
| Grant date | Jul 19, 2005 |
| Priority date | — |
| Expiry date | May 27, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A system of determining and correcting alignment during imprint lithography process is described. During an imprint lithographic process the template may be aligned with the substrate by the use of alignment marks disposed on both the template and substrate. The alignment may be determined and corrected for before the layer is processed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.