Apparatus for analyzing a substrate employing a copper decoration
US6919214B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2003 |
| Grant date | Jul 19, 2005 |
| Priority date | — |
| Expiry date | Jan 13, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N33/0095
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for analyzing a substrate employing a copper decoration includes a bath having at least two receiving containers for receiving electrolytes, slots formed at insides of the receiving containers for receiving substrates to be analyzed in a direction that is normal to a bottom face of the bath, lower copper plates provided in the receiving containers, the lower copper plates making contact with entire rear faces of the substrates received in the receiving containers, upper copper plates provided in the receiving containers, each of the upper copper plates corresponding to a respective one of the lower copper plates, and separated from front faces of the substrates, and a power source connected to the upper copper plates and the lower copper plates for providing voltages to the same. A plurality of substrates may be simultaneously analyzed using one apparatus thereby greatly reducing an amount of time required for the analysis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.