Patent · US Expired

Method for thermally treating substrates

US6919538B2 · kind B2 · utility

6Cited by

4References

15Claims

0Family size

Assignee

Steag Hamatech AG · US

Inventors

Jakob Szekeresch · Westerburg, DE
Peter Dress · Bruchsal, DE
Uwe Dietze · Sternenfels, DE
Werner Saule · Bretten, DE

Key dates

Filing date	Nov 28, 2001
Grant date	Jul 19, 2005
Priority date	—
Expiry date	Nov 28, 2021

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/67248
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

To increase the temperature homogeneity on the surface of a substrate that is to be thermally treated, a method for thermally treating substrates is provided, according to which the substrate is heated by several separately controllable heating elements. A desired-value profile is predefined for each of said heating elements. The method comprises the following steps: locally-analysed measurement of the temperature of the surface of the substrate that faces away from the heating elements, during the thermal treatment; determination of the temperature inhomogeneities occurring on the substrate surface; definition of new desired-value profiles based on said temperature inhomogeneities; and preparation of the new desired-value profiles for subsequent treatments.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.