System for testing a group of IC-chips having a chip holding subassembly that is built-in and loaded/unloaded automatically
US6919718B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2003 |
| Grant date | Jul 19, 2005 |
| Priority date | — |
| Expiry date | Nov 10, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2867
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An electromechanical system for testing IC-chips includes a chip holding subassembly which has sockets for holding a group of IC-modules that include the IC-chips; a moving mechanism for automatically moving the chip holding subassembly from a load position in the system to a test position in the system, and visa-versa; a temperature control mechanism which contacts the IC-modules on the chip holding subassembly only when that subassembly is at the test position; and a chip handler mechanism for automatically moving the IC-modules into and out of the sockets, when the chip holding subassembly is at the load position. At the test position, the temperature control mechanism contacts the IC-modules to control their temperature. At the load position, the chip handler mechanism automatically unloads one group of IC-modules from the sockets on the chip holding subassembly and automatically loads another group of the IC-modules into the sockets.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.