High-resolution overlay alignment methods for imprint lithography
US6921615B2 · kind B2 · utility
89Cited by
199References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2001 |
| Grant date | Jul 26, 2005 |
| Priority date | — |
| Expiry date | Feb 12, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24802
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of determining and correcting alignment during imprint lithography process is described. During an imprint lithographic process the template may be aligned with the substrate by the use of alignment marks disposed on both the template and substrate. The alignment may be determined and corrected for before the layer is processed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.