Apparatus and method for chemical mechanical polishing process
US6923710B2 · kind B2 · utility
Inventor
Key dates
| Filing date | Aug 2, 2004 |
| Grant date | Aug 2, 2005 |
| Priority date | — |
| Expiry date | Aug 2, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus and method for chemical mechanical polishing are disclosed. An example apparatus for use with a chemical mechanical polishing (CMP) process includes a polishing part configured to perform a CMP process to a polishing endpoint for a polishing target deposited on a substrate, a cleaning part configured to clean the substrate, and a resistance measurement part configured to measure a sheet resistance of the substrate. The example apparatus also includes a CMP control part configured to determine based on the sheet resistance whether a residual target exists, to estimate re-polishing time, and to control the polishing part to perform a re-polishing process if the residual target exists.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.