Patent · US Expired

Coil on a semiconductor substrate and method for its production

US6924725B2 · kind B2 · utility

3Cited by

6References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Kevni Bueyuektas · Birkenfeld, DE
Klaus-Peter Koller · Bad Soden, DE
Karlheinz Mueller · Friedrichshafen, DE

Key dates

Filing date	Sep 21, 2004
Grant date	Aug 2, 2005
Priority date	—
Expiry date	Sep 21, 2024

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/4902
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A coil apparatus includes a coil trace, a semiconductor substrate and a dielectric layer arranged on the semiconductor substrate, at least parts of the coil trace being arranged above a recess in the dielectric layer. The coil apparatus further includes a support apparatus arranged in the recess and connected to the coil trace for mechanically supporting the coil trace. The supporting apparatus is preferably a conductive column that is not removed when the recessed is formed in the dielectric layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.