Pressure sensor
US6925885B2 · kind B2 · utility
14Cited by
10References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2002 |
| Grant date | Aug 9, 2005 |
| Priority date | — |
| Expiry date | Jun 5, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/8592
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A pressure sensor includes a sensor element, and a resin package member that holds the sensor element. The sensor element is constructed by a semiconductor, and is capable of externally outputting an electric signal in accordance with strain generated when force is applied thereto. The sensor element is directly adhered to the package member via an adhesive layer that has Young's modulus in a range between 2.45×103 Pa and 2.06×104 Pa. Further the adhesive layer has a thickness equal to or more than 110 μm. Accordingly, the pressure sensor effectively restricts a variation in a sensor characteristic due to a thermal change.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.