Thin film forming apparatus and thin film forming method
US6926057B2 · kind B2 · utility
3Cited by
3References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2002 |
| Grant date | Aug 9, 2005 |
| Priority date | — |
| Expiry date | Dec 28, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1705
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus for forming a thin film pattern on the surface of a substrate. This apparatus is provided with: a transfer member having a thin film carrying surface which carries a thin film pattern; and a thin film transfer mechanism for joining the transfer member to a substrate for transferring, to the substrate, the thin film pattern on the thin film carrying surface. The thin film pattern may be a wiring film pattern. A gelatinous film may previously be formed on the substrate, and the thin film pattern may be transferred as embedded in the gelatinous film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.