Ultrasonic manufacturing apparatus
US6926187B2 · kind B2 · utility
3Cited by
22References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2003 |
| Grant date | Aug 9, 2005 |
| Priority date | — |
| Expiry date | Sep 23, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention pertains to a multilayer flexible wiring board.The multilayer flexible wiring board including first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer, wherein the resin film is adapted to form an opening when the bump to force into the resin film and an ultrasonic wave is applied to the bump and the bump is left in the opening to electrically connect the top of the bump to the first wiring layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.