Electronic parts mounting method and device therefor
US6926796B1 · kind B1 · utility
32Cited by
9References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2000 |
| Grant date | Aug 9, 2005 |
| Priority date | — |
| Expiry date | Jan 26, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is corrected, the bumps are compressed, and the insulating resin is hardened.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.