Analysis method of film thickness distribution and design system of printed circuit board and manufacturing processes
US6926816B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2003 |
| Grant date | Aug 9, 2005 |
| Priority date | — |
| Expiry date | Jan 27, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/241
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The object of the present invention is to provide a film thickness distribution analysis method that ensures quick and effective prediction of film thickness distribution by computer simulation in the pattern plating process.On the circuit pattern of a printed circuit board, in the method for analyzing the thickness distribution of metal film plated selectively, hypothetically dividing the printed circuit board into one or more regions, introducing pattern density θj=Aj/Sj (Sj: the area Sj of a desired region j, and Aj: the area of the plated surface inside the area j), and calculating the approximate average current density or film thickness distribution based on “approximation averaged by pattern density”.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.