Solution processing apparatus and solution processing method
US6926817B2 · kind B2 · utility
5Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 2002 |
| Grant date | Aug 9, 2005 |
| Priority date | — |
| Expiry date | May 29, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/2885
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plating apparatus includes a plating solution tank which stores a plating solution, a holder including an inner space to house a wafer and an opening for the wafer to be in contact with the plating solution, and a nitrogen supplying mechanism to supply nitrogen to the inner space of the holder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.