Methods and apparatus for attaching MEMS devices to housing
US6927098B2 · kind B2 · utility
4Cited by
14References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2003 |
| Grant date | Aug 9, 2005 |
| Priority date | — |
| Expiry date | May 7, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19041
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for increasing the bonding strength between a die and a housing for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method comprises depositing a plurality of clusters of contact material onto a bottom surface of the housing, placing the die onto the clusters, and subjecting the housing, the clustered contacts, and the die to a thermocompression bonding process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.