Chemical mechanical electropolishing system
US6927177B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2003 |
| Grant date | Aug 9, 2005 |
| Priority date | — |
| Expiry date | Oct 24, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/907
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A system for thinning a layer on a substrate without damaging a delicate underlying layer in the substrate. The system includes means for mechanically eroding the layer on the substrate, and means for electropolishing the layer on the substrate. In this manner, portions of the layer that cannot be removed by electropolishing can be removed by the mechanical erosion. However, electropolishing can preferentially be used on some portions of the layer so that unnecessary mechanical stresses can be avoided. Thus, the system imparts less mechanical stress to the substrate during the removal of the layer, and the delicate underlying layer receives less damage during the process, and preferably no damage whatsoever.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.