Method for determining optimum bonding parameters for bonding with a wire bonder
US6929168B2 · kind B2 · utility
4Cited by
16References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2003 |
| Grant date | Aug 16, 2005 |
| Priority date | — |
| Expiry date | May 13, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/12042
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for finding optimum bond parameters for a bond force FB and an ultrasonic variable P and, optionally, at least one further bond parameter of a wire bonder uses a sensor sensitive to a shear force exerted by the capillary on a connection point. A predetermined number of bonding operations with varying bonding parameters is performed. Optimum bond parameters are derived from the signal of the sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.