Integrated circuit substrate having laser-embedded conductive patterns and method therefor
US6930256B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 1, 2002 |
| Grant date | Aug 16, 2005 |
| Priority date | — |
| Expiry date | May 17, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49167
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrated circuit substrate having laser-embedded conductive patterns provides a high-density mounting and interconnect structure for integrated circuits. Conductive patterns within channels on the substrate provide interconnects that are isolated by the channel sides. A dielectric material is injection-molded or laminated over a metal layer that is punched or etched. The metal layer can provide one or more power planes within the substrate. A laser is used to ablate channels on the surfaces of the outer dielectric layer for the conductive patterns. The conductive patterns are electroplated or paste screen-printed and an etchant-resistive material is applied. Finally, a plating material can be added to exposed surfaces of the conductive patterns. An integrated circuit die and external terminals can then be attached to the substrate, providing an integrated circuit having a high-density interconnect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.