Electronic component including a housing and a substrate

US6930383B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Hans-Jurgen Hacke · Birkenfeld, DE
• Holger Hubner · Baldham, DE
• Axel Königer · Birkenfeld, DE
• Max Seitz
• Rainer Tilgner · Birkenfeld, DE

Key dates

• Filing date: Dec 16, 2002
• Grant date: Aug 16, 2005
• Expiry date: Apr 28, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/14
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The invention relates to an electronic component including a housing and a first substrate having at least one integrated circuit, a multiplicity of contact surfaces arranged in an arbitrary distribution on the surface of the first substrate. A second substrate forms a housing and is mechanically joined to the surface of the first substrate in a surface-to-surface contact, via an insulating joining layer. The second substrate has contact connection surfaces that are surface-to-surface connected to the contact surfaces of the first substrate in an electrically conductive manner. The second substrate has symmetrically arranged external contact surfaces that are conductively connected to the contact connection surfaces via through-contacts in the second substrate.