Post singulation die separation apparatus and method for bulk feeding operation
US6932136B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2004 |
| Grant date | Aug 23, 2005 |
| Priority date | — |
| Expiry date | Apr 8, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/19
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A post singulation, die separation assembly for bulk separation of a plurality of dice in a singulated wafer from the adhesive backing of wafer saw tape. The die separation assembly includes a support base having a support surface, a first portion and an opposite second portion thereof. The second portion includes a down-ramped portion thereof skewed downwardly at a first acute angle from the support surface. A feed tray includes a collection end positioned adjacent the base second portion such that an elongated, substantially thin gap is formed between the tray collection end and at least a portion of the base second portion. A flexible platform is movably supported atop the base support surface for movement from the first portion to the second portion thereof. At the second portion, the platform passes downward through the gap formed between the tray collection end and the at least a portion of the base second portion. The platform defines an upward facing surface upon each die of the singulated wafer is adhered thereto, via the saw tape, in a forward aligned manner. Upon movement of the flexible platform down the down-ramped portion of the support base, a portion of the wafer sa…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.