Plasma encapsulation for electronic and microelectronic components such as organic light emitting diodes

US6933538B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Arvid Hunze · Erlangen, DE
• Rainer Leuschner · Regensburg, DE
• Matthias Lipinski · Poughkeepsie, US
• Egon Mergenthaler · Birkenfeld, DE
• Wolfgang Rogler · Erlangen, DE
• Georg Wittmann · Herzogenaurach, DE

Key dates

• Filing date: Aug 31, 2001
• Grant date: Aug 23, 2005
• Expiry date: Aug 31, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K59/873

Abstract

Plasma encapsulation for electronic and microelectronic components such as OLEDs. The invention relates to a plasma encapsulation for electronic and microelectronic components such as OLEDs. However, a conventional standard plasma coating process is not used; instead, an especially gentle plasma coating process which does not cause any damage to sensitive components such as an OLED is used, such as the pulsed method or the “remote” or “after glow method.”